Home > Products > Laser Bonding System

  MODEL : JLB073-M-M


  GENERAL SPECIFICATION
    1. Fast bonding time : 2 sec/ea ( 1 head )
    2. High reliable bonding quality : high bonding strength
    3. Full auto or semi auto process
    4. High flexible process : special TAG, sheet type, film type, strap
    5. Applications : seramic, stick bar, film type RFID tag


  FEATURES  
    1. WAFER HANDLING 2. ACF PRE-BONDING
        - Wafer chip size : 600~1000 ㎛     - Adhesive : ACF film
        - Position accuracy : ±1/4 pixel     - Width : 1.0 ~ 1.2 ㎜
        - Angle accuracy : ±0.1°     - Temp. : < 100°
        - Speed : < 5 sec     - Pressure : < 1 ~ 3 MPa
        - Pre-align vision system  


 


    3. VISION SYSTEM 4. LASER BONDING
        - 256 grey levels inspection     - Laser power : 30 W
        - Position accuracy : ±1/4 pixel     - Bonding time : 2 sec
        - Angle accuracy : ±0.1°     - Current : 43 A
        - Angle tolerance : ±180°     - Aim beam
          - Fiber type