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Why Laser ???
1. Narrow Saw Street Width
2. Lots of Metals in Saw Street
3. Low-K/Sapphire Devices
4. Thin Wafer Application
5. GaAs Wafer Application
6. Multi-Die in a Wafer Application
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Wafer Sawing Techniques
-Existing wafer Sawing technologies
-Sawing Trend
-Laser Sawing/Hybrid Sawing(CO2 Laser + UV laser)
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Why Laser Engraving?
-Semiconductor chips for key devices are becoming
thinner & soft
-Current-generation industrial UV lasers are faster
than dicing saws for wafer
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thinner than 120 ~150 um
-Thinner wafers are more difficult to dice with
conventional saws (Due to chipping,Breaking)
-Alternative technologies are desired ; several
Laser processes are currently under evaluation.
UV ablative cutting is one of those
-Saw speeds must be decreased, leading to low dicing
throughput (Due to chipping,Breaking)
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