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  Benefit of Atmospheric Plasma
    1. No Charge-up Damage
    2. Compact Deign : Easy Integration into Existing Machine
    3. High Speed with Continuous Processing in production Line
    4. High Density Plasma Generation in Atmospheric Pressure
    5. Wattability are Improved by leaning Organic Contaminants and Improving the surface
     Energy for PCB, TFT/LCD, Polyimide
    6. Improves for bonding Reliability Laminating Adhesions and Wattability
 
 
  Advantage with Atmospheric PLASMA Cleaning
    1. No Wire Short and Sagging Problems
   (Note) Wire Short Rate is 1.25% at Vacuum Type PLASMA 1 mil au Wire, More 180 mil Wire Length
    2. No Over Etching & Charge-up Damage
    3. Cleaning Performance is Equivalent or better than Vacuum Type
    (Value of ball shear and wire pull is higher than vacuum type)
    4. Uniform Cleaning Performance by Strip Base PLASMA
    5. Possibility to Install on Existing Machine by Retrofit PLASMA Module Head
    6. Use N2 Gas (Option Ar, He, O Gas)
    7. Top & Bottom Side Cleaning (Option )
    8. Compact Plasma Head : 126mm(W) X 123(D) X 119(H)